1.0超快激光https://cklasersz.com/zhCKadminhttps://cklasersz.com/zh/author/ckadmin/rich600338<blockquote class="wp-embedded-content" data-secret="nJcsHqxmHd"><a href="https://cklasersz.com/zh/applications/semiconductor-industry-chip-packaging-molds/">半导体行业芯片封装模具</a></blockquote><iframe sandbox="allow-scripts" security="restricted" src="https://cklasersz.com/zh/applications/semiconductor-industry-chip-packaging-molds/embed/#?secret=nJcsHqxmHd" width="600" height="338" title="《 Semiconductor Industry  Chip Packaging Molds 》—Super Fast Laser" data-secret="nJcsHqxmHd" frameborder="0" marginwidth="0" marginheight="0" scrolling="no" class="wp-embedded-content"></iframe><script> /*! This file is auto-generated */ !function(d,l){"use strict";l.querySelector&&d.addEventListener&&"undefined"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!/[^a-zA-Z0-9]/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret="'+t.secret+'"]'),o=l.querySelectorAll('blockquote[data-secret="'+t.secret+'"]'),c=new RegExp("^https?:$","i"),i=0;i<o.length;i++)o[i].style.display="none";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute("style"),"height"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):"link"===t.message&&(r=new URL(s.getAttribute("src")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener("message",d.wp.receiveEmbedMessage,!1),l.addEventListener("DOMContentLoaded",function(){for(var e,t,s=l.querySelectorAll("iframe.wp-embedded-content"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute("data-secret"))||(t=Math.random().toString(36).substring(2,12),e.src+="#?secret="+t,e.setAttribute("data-secret",t)),e.contentWindow.postMessage({message:"ready",secret:t},"*")},!1)))}(window,document); </script>https://cklasersz.com/wp-content/uploads/2025/11/主图.jpg10801440Laser Cleaning Specific Applications: A. Epoxy Molding Compound Residue This is the most common contaminant. During the transfer molding process, epoxy molding compound (EMC) forms hard, carbonized residue on mold parting surfaces, cavity corners, and ejector pinholes. These residues contain fillers such as silicon powder and are very stubborn. B. Release Agent Accumulation Mold release […]