{"id":870,"date":"2025-11-09T21:55:40","date_gmt":"2025-11-09T13:55:40","guid":{"rendered":"https:\/\/cklasersz.com\/?p=870"},"modified":"2025-11-09T21:55:40","modified_gmt":"2025-11-09T13:55:40","slug":"semiconductor-industry-chip-packaging-molds","status":"publish","type":"post","link":"https:\/\/cklasersz.com\/zh\/applications\/semiconductor-industry-chip-packaging-molds\/","title":{"rendered":"\u534a\u5bfc\u4f53\u884c\u4e1a\u82af\u7247\u5c01\u88c5\u6a21\u5177"},"content":{"rendered":"

\u6fc0\u5149\u6e05\u6d01\u5177\u4f53\u5e94\u7528\uff1a<\/strong><\/p>\n\n\n\n

A. <\/strong>Epoxy Molding Compound Residue<\/p>\n\n\n\n

This is the most common contaminant. During the transfer molding process, epoxy molding compound (EMC) forms hard, carbonized residue on mold parting surfaces, cavity corners, and ejector pinholes. These residues contain fillers such as silicon powder and are very stubborn.<\/p>\n\n\n\n

B. <\/strong>\u8131\u6a21\u5242\u79ef\u7d2f<\/p>\n\n\n\n

Mold release agents used to ensure smooth demolding will continuously carbonize at high temperatures, forming a difficult-to-remove insulating film on the mold surface, affecting the surface quality and release performance of the molded product.<\/p>\n\n\n\n

C.<\/strong> Inorganic Contaminants<\/p>\n\n\n\n

Metal Flash: This arises from impurities in the molding compound or minor mold wear.<\/p>\n\n\n\n

Oxide Layer: This is a surface oxide formed by long-term use of the mold in high-temperature environments.<\/p>\n\n\n\n

\u4f18\u52bf\u5c3a\u5bf8\uff1a<\/strong><\/p>\n\n\n\n

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  1. Extreme Cleanliness, Zero Secondary Contamination: “Dry” cleaning eliminates any residual media. After cleaning, the mold surface is as clean as new, eliminating secondary contamination (such as chemical residue and media particles) introduced by cleaning at the source.<\/li>\n<\/ol>\n\n\n\n

    B.<\/strong> Improve chip product yield and reliability. By achieving 100% consistent, residue-free cleaning, this system completely eliminates defects such as poor chip bonding, warping, cracks, voids, and pitting caused by mold contamination, directly improving product yield and long-term reliability.<\/p>\n\n\n\n

    C. <\/strong>Meet absolute dust-free environment requirements. The equipment can be fully integrated into automated production lines and operate within a partial vacuum hood. Combined with a vacuum system, it meets the high-grade cleanroom requirements of chip manufacturing.<\/p>\n\n\n\n

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